Table 2.1 Summary of the parameters of the pixel system.							
							
General							
	Pixel size: 50 x 300 µ		Average power per pixel: 17µW				
							
Barrel							
	Die size: 9.85x12.85 mm		Number pixels per chip: 32 colums(z) x 192 rows(phi)				
							
	Module size:	29.80 x 59.95 mm total - see Fig. 8.1					
							Total
		No. of	No. of 	No. of	No. of		Silicon
Radius(cm)	Length(cm)	staves	modules	chips	channels	Power(kW)	Area(sq. m)

4.9	72.49	16	192	2304	1.42E+07	0.24	0.34
							
11.03	72.49	36	432	5184	3.19E+07	0.54	0.77
							
15.93	84.58	52	728	8736	5.37E+07	0.91	1.30
							
	Totals with B-physics layer	104	1352	16224	9.97E+07	1.69	2.42
							
	Totals without B-physics layer	88	1160	13920	8.55E+07	1.45	2.07

Disks							
	Chip sizes: varies			Module size - see Fig. 8.9			
							Total
	Inner	Outer 	No. of	No. of	No. of		Silicon
z(cm)	Radius(cm)	Radius)cm)	wedges	chips	channels	Power(kW)	Area(sq. m)

52.2	11	20.92	144	1440	6.63E+06	0.11	0.18
							
59.2	11	20.92	144	1440	6.63E+06	0.11	0.18
							
77.2	11	20.92	144	1440	6.63E+06	0.11	0.18
							
85.0	11	20.92	144	1440	6.63E+06	0.11	0.18
							
		Total - per end	576	5760	2.65E+07	0.45	0.72
							
		Totals - both ends	1152	11520	5.31E+07	0.90	1.44

Totals					Total		
		No. of 	No. of		Silicon		
		channels	chips	Power(kW)	Area(sq. m)		
							
With B-physics layer		1.53E+08	27744	2.60	3.86		
							
Without B-physics layer		1.39E+08	25440	2.36	3.51